Reversible production process for assembly of circuit board and substrate
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United States of America Patent
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-
Feb 2, 1993
Grant Date -
N/A
app pub date -
Nov 8, 1991
filing date -
Nov 9, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Production process for the reversible assembly of an electronic read and/or operating circuit board having a front face with conductive tracks and a rear face which is metallized and an electrically conductive or nonconductive support or substrate which may include metallized conductive tracks. The assembly is achieved by use of an electrically insulating silicone adhesive layer. A conductive foil is interposed between the rear face of the circuit board and the adhesive layer and is connected to a terminal in the support.
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