Method and apparatus for reflow-soldering of printed circuit boards
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United States of America Patent
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-
Jan 19, 1993
Grant Date -
N/A
app pub date -
Jul 24, 1991
filing date -
Jul 25, 1990
priority date (Note) -
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Abstract
A method and apparatus for reflow-soldering of printed circuit boards are disclosed. A printed circuit board having electronic parts with lead wires having low temperature resistance alone or together with electronic part of high temperature resistance can be soldered according to the reflow-soldering method in a specifically designed heating zone involving plural preheating chambers and a reflowing chamber while maintaining a difference in temperature between the obverse surface and the reverse surface of the board without causing any soldering failure and any environmental pollution.
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