Thermosetting resin composition
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United States of America Patent
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Jan 12, 1993
Grant Date -
N/A
app pub date -
Dec 9, 1991
filing date -
Jun 19, 1987
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A thermosetting resin composition comprising (A) 60 to 95% by weight of a prepolymer or precopolymer selected from the group consisting of (A-1), (A-2) and (A-3) below, (A-1) a prepolymer of diallyl phthalate, (A-2) a precopolymer of diallyl terephthalate derived from diallyl terephthalate of the following formula (1) ##STR1## and an aromatic benzyl hydrocarbon having at least one hydrogen atom at the benzyl position and represented by the following formula (2) ##STR2## wherein each of R.sup.1 and R.sup.2 represents a member selected from the class consisting of a hydrogen atom and lower alkyl groups, and n is an integer of 1 to 3, and (A-3) a mixture of (A-1) and (A-2), and (B) 40 to 5% by weight of a polyacrylate or polymethacrylate of dipentaerythritol having at least 4 acryloyl or methacryloyl groups in the molecule and represented by the following formula ##STR3## wherein each R.sup.3 represents a hydrogen atom, --COCH.dbd.CH.sub.2 or ##STR4## and at least four R.sup.3 groups represent --COCH.dbd.CH.sub.2 or ##STR5##
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