Material for mold and process of forming mold by using this material

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United States of America Patent

PATENT NO 5177140
SERIAL NO

07474037

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A material for a mold which comprises, as main components, a refractory aggregate and a hardenable binder comprising a polyfunctional acrylamide having at least two ethylenically unsaturated groups in the molecule, has an excellent low-temperature rapid hardenability, disintegrability, and pot life and is especially suitable as a material for a mold for casting a low-melting-point metal such as an aluminum alloy.

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Patent Owner(s)

Patent OwnerAddress
ASAHI YUKIZAI KOGYO CO LTDNOBEOKA-SHI MIYAZAKI-KEN 882

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kai, Isao Tokyo, JP 12 285
Ogawa, Fumiyuki Niwa, JP 2 10
Osada, Mitsuhiro Niwa, JP 2 8
Ota, Yoshiomi Nobeoka, JP 1 7
Tamemoto, Kazuo Tokyo, JP 2 16
Tominaga, Kyouji Niwa, JP 1 7

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