Composite material for electrical applications reinforced by para-oriented aramide fibrous substance and process for preparing same

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United States of America Patent

PATENT NO 5173359
SERIAL NO

07579079

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Abstract

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A composite material for electrical applications reinforced by a para-oriented aramide fibrous substance made of a para-oriented aramide fibrous substance selected from the group consisting of poly(p-phenylene terephthalamide) fiber and poly(p-phenylene-3,4'-diphenyl ether terephthalamide) fiber, a thermosetting resin matrix and a polymer having at least one specific reactive cross-linking group selected from the group consisting of carboxyl group, epoxy group, hydroxyl group and methylol group. The polymer resides at the interface between the para-oriented aramide fibers and the thermosetting resin matrix. The composite material for electrical applications can be prepared according to a method having the steps of treating a para-oriented aramide fibrous substance selected from the group consisting of poly(p-phenylene terephthalamide) fiber and poly(p-phenylene-3,4'-diphenyl ether terephthalamide) fiber with an emulsion containing a polymer carrying at least one reactive cross-linking group selected from the group consisting of carboxyl, epoxy, hydroxyl and methylol groups and a particle size ranging from 0.01 to 0.08 .mu., drying the treated fibrous substance and then laminating the fibrous substance with a thermosetting resin matrix. The composite material shows excellent properties well suited for use, in particular, as a composite material for electrical applications or a reinforcing substrate such as a printed circuit board or an insulating laminate.

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Patent Owner(s)

Patent OwnerAddress
HONSHU PAPER CO LTDCHUO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kimura, Megumi Kawasaki, JP 21 387
Toyoshima, Setuo Tokyo, JP 3 45

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