Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
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United States of America Patent
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Nov 24, 1992
Grant Date -
N/A
app pub date -
Jul 3, 1989
filing date -
Jul 3, 1989
priority date (Note) -
Expired
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Abstract
A hermetic semiconductor package includes a ceramic lid with the device leads extending vertically through the lid. The leads are mechanically retained within the apertures in the lid and direct bonded to the lid to provide a hermetic seal and a substantial lead density.
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