Curable dielectric polyphenylene ether-polyepoxide compositions
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United States of America Patent
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Nov 10, 1992
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N/A
app pub date -
Jan 3, 1990
filing date -
Feb 17, 1989
priority date (Note) -
Expired
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Abstract
Curable compositions contain a low molecular weight polyphenylene ether and a polyepoxide composition containing brominated and non-brominated bisphenol polyglycidyl ethers, in combination with further components including specific catalysts. Said compositions are preferably free from hardeners for epoxy resins. They may be used in the preparation of bonding sheets which are useful in the manufacture of multilayer printed circuit assemblies and which have excellent physical and electrical properties.
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