Bath for immersion plating tin-lead alloys
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United States of America Patent
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Nov 3, 1992
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N/A
app pub date -
May 29, 1990
filing date -
May 29, 1989
priority date (Note) -
Expired
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Abstract
The invention provides a bath for immersion plating a substance with a tin-lead alloy, which includes tin(II) ions, lead(II) ions, organic sulfo groups and thiourea or a mixture of thiourea and a thiourea derivative for a complexing agent. The organic sulfo groups allow insoluble thiourea complexes to be stably dissolved in the solution of the bath; thereby there is no need to retain the bath at a high temperature. Compared with conventional baths for immersion plating, the bath of the invention attains stable plating and a longer life of itself. Addition of the thiourea derivative prevents whiskers from being deposited and allows uniform and sufficiently smooth plating.
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