Multilayer ceramic substrate and manufacture thereof
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United States of America Patent
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Oct 20, 1992
Grant Date -
N/A
app pub date -
Dec 21, 1990
filing date -
Dec 21, 1989
priority date (Note) -
Expired
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Abstract
A multilayer ceramic substrate having improved mechanical and electrical properties and suitable for use to form a hybrid integrated circuit and a process for the manufacture thereof. The multilayer ceramic substrate has at least one layer of a first conductor based on a refractory metal as an internal conductor layer and at least one layer of a Cu-based second conductor as a surface conductor layer, wherein the second conductor layer is connected to the first conductor layer through a metallic layer formed by coating with a metalloorganics paste containing one or more metals selected from the group consisting of Pt, Pd, Ni, Cu, Au, Rh, Ru, Re, Co, and Ir followed by firing in an inert or reducing atmosphere.
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