Vapor reflow type soldering method and apparatus therefor
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United States of America Patent
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-
Oct 20, 1992
Grant Date -
N/A
app pub date -
Dec 20, 1990
filing date -
Dec 25, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In case of suspending an apparatus upon the completion of soldering operation, from not smaller than 50% to less than 95% of a thermomedium in a reflow section is transferred to a filtering tank and the remaining thermomedium is made to pass through a water separator in advance of suspending the apparatus, so that water in the thermomedium is removed. This water removing operation makes it possible to prevent the corrosion of the reflow section and the deterioration of the thermomedium. Additionally, a method is disclosed for preventing water to be mixed with the thermomedium by warming the reflow section before operation.
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