Method for plating palladium
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United States of America Patent
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Sep 22, 1992
Grant Date -
N/A
app pub date -
Jul 16, 1990
filing date -
Jul 16, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for plating palladium on Group IV-B and V-B metals, particularly niobium, vanadium, zirconium, titanium and tantalum as pure metals and as alloys is described. The method provides the metal to be plated with a roughened exposed surface to be plated which has been electrolytically hydrided and then the surface is plated using electroless or electrolytic plating. Hydride is removed from the plated surface, usually by heating. This also removes other surface impurities and aids the coat adhesion. The resulting palladium plated metal articles are usful for hydrogen extraction.
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