Apparatus and method for detecting missing interconnect material
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United States of America Patent
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Sep 22, 1992
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N/A
app pub date -
Jul 15, 1991
filing date -
Jul 15, 1991
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Abstract
Apparatus and method for detecting missing interconnect material. The distance traveled by a bonding tool is measured while the interconnect material is being bonded to a site. Unless it exceeds a predetermined threshold, a signal is generated indicating missing interconnect material. A pivoting system associated mating electrical contacts, and a measurement/comparator are advantageously employed to facilitate this measurement.
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