Importance

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Abstract

A polymer film interconnect forms an electrical interconnect between a first pattern of electrical conductors on a first electrical component and a second pattern of electrical conductors on a second electrical component. The polymer film interconnect includes a thin, flexible, self-supporting dielectric polymeric film having a pattern of spaced apart thru-holes containing separate quantities of an electrically conductive bonding material capable of heat bonding to the first electrical conductors adjacent the first surface of the film and to the second conductors adjacent the second surface of the film. This provides a plurality of discrete electrically isolated conductive paths from the first pattern of electrical conductors through the film to the second pattern of electrical conductors on the opposite side of the film. The polymer film interconnect can be used for forming interconnects between a number of electrical components, including connections between an IC chip and a leadframe or spreader; an IC chip and a chip carrier; an IC chip and a circuit board; an IC chip carrier and a circuit board; and a spreader or leadframe and a circuit board.

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First Claim