Method for manufacturing rigid-flexible circuit boards and products thereof
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United States of America Patent
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-
Sep 1, 1992
Grant Date -
N/A
app pub date -
Feb 5, 1991
filing date -
Feb 5, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for manufacturing rigid-flexible multilayer printed circuit boards and the products thereof. The method comprises the compression molding several layers of materials comprised of a rigid layer, a separation layer, a flexible insulating layer, adhesives, and conductive metal to form a laminate. Flexibility is provided in the printed circuit board by slots in the rigid layer which define the flexible region, the application of flexible insulating material over the defined flexible region, and the removal of the rigid material which occupied the defined flexible region (plug). As disclosed by the present method, a flexible insulating layer is provided in the flexible regions only without the use of preliminary laminates. This method does not require the use of pressure equalizing cushions and does not result in relief formation on an upper layer of conductive metal during compression molding. After forming the composite laminate, it may be shaped as desired, and plated through holes may be provided in the rigid layer by known techniques.
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