Method of manufacturing sputtering target assembly
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 1, 1992
Grant Date -
N/A
app pub date -
Jul 10, 1991
filing date -
Jul 10, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Described is a method of manufacturing a sputtering target assembly is that minimizes distortion during manufacture and a novel target assembly so produced. The method involves positioning a backing member in an external shoulder formed in the target member, electron beam welding mating surfaces and machining the interior surface of the welded assembly to provide a coextensive surface along the inner surfaces of the target and backing members. The resulting target assembly can withstand high water pressure and high sputter power levels.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully