Ceramic package component having one quarter wavelength spaced conductive grounding vias
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United States of America Patent
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Aug 25, 1992
Grant Date -
N/A
app pub date -
Jul 6, 1990
filing date -
Jul 11, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A ceramic package component has a base portion and an upstanding enclosing wall on the base portion, the upper surface of the wall being provided with an electrically conductive coating in order to receive a lid sealingly thereon. The electrically conductive coating on the upper surface of the wall is electrically connected to a further conductive coating on the undersurface of the base portion by means of a high density array of conductive vias extending through the wall. The inter via spacing between adjacent vias is preferably less than one quarter of the wavelength of the frequency at which the component is to operate.
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