Curable polyphenylene ether-polyepoxide compositions from melt processed polyphenylene ethers, and laminates prepared therefrom
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United States of America Patent
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Aug 25, 1992
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N/A
app pub date -
Jun 27, 1990
filing date -
Oct 11, 1988
priority date (Note) -
Expired
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Abstract
Compositions comprising a polyepoxy compound (preferably bisphenol A diglycidyl ether) and a polyphenylene ether which has been melt processed (e.g., by extrusion) at a temperature in the range of about 230.degree.-390.degree. C., are cured at temperatures in the range of about 190.degree.-250.degree. C. by various epoxy cure catalysts. They may used in the preparation of laminates with excellent dielectric properties, solvent resistance and solder resistance, useful in printed circuit board production.
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