Method of forming a hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip
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United States of America Patent
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Aug 4, 1992
Issued Date -
N/A
app pub date -
Sep 25, 1991
filing date -
Jun 16, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A hermetically sealed package for a semiconductor device includes a lid through which the leads of the device extend vertically away from the chip through an aperture in the lid which is hermetically sealed by the external terminal or electrode. The package is compact, lightweight and free of magnetic materials.
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