Solderless spring socket for printed circuit board
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United States of America Patent
Stats
-
Aug 4, 1992
Issued Date -
N/A
app pub date -
Jan 14, 1992
filing date -
Jun 7, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A solderless spring socket for use in printed circuit boards is disclosed. The socket includes a first section having outwardly biased, resilient retention members for engaging a wall of a plated through hole in the circuit board to retain the socket therein. The socket further includes a second section having inwardly biased spring fingers for compressively engaging a lead from an electronic package inserted thereinto.
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