Wheat flour and wheat flour composite for breadstuff

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United States of America Patent

PATENT NO 5130158
SERIAL NO

07662377

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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There is disclosed a wheat flour comprising not less than 60% by weight of flours which pass through a screening surface having an opening of 75 microns and remain on a screening surface having an opening of 38 microns, which is suitable for the manufacture of a bread, a pasta and noodle. Also disclosed is a wheat flour composite for breadstuff wherein the wheat flour is compounded with a thicker and optionally a malt. The wheat flour composite is suitable for the manufacture of a high quality bread having good appearance, good textural and taste characteristics.

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Patent Owner(s)

Patent OwnerAddress
NISSHIN FLOUR MILLING INC25 KANDA-NISHIKI-CHO 1-CHOME CHIYODA-KU TOKYO 101-8441

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Otsubo, Hiroshi Tokyo, JP 11 269
Takaya, Akira Saitama, JP 3 26

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