Additive for fluxes and soldering pastes
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United States of America Patent
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Jul 7, 1992
Grant Date -
N/A
app pub date -
Jul 31, 1990
filing date -
Aug 16, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An additive contains a deactivation agent functioning at soldering temperature. This novel additive is used for fluxes and soldering pastes. In the course of soldering, the deactivation agent in the additive deactivates an activator such as organic acids contained in the flux and the soldering paste in order for removal of an oxide film from a metallic base used for electric circuit. By use of the additive, corrosion of the metallic base with the activator is prevented even though the activator remains on the base. The additive enables one to omit an unnecessary washing step from a preparation of electric circuit.
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