Universal surface mount package
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United States of America Patent
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Jun 16, 1992
Grant Date -
N/A
app pub date -
May 7, 1990
filing date -
May 7, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A hermetically sealed surface mount electronic component package can be manufactured by converting standard, readily available flat-packs. The package has a base, with an opening through which a primary transmission lead extends, a glass-to-metal seal surrounding the transmission lead in the opening, and a secondary transmission lead extends from the primary transmission lead so that it is spaced from the base and its end is at least flush with the bottom of the base. An insulator can be provided between the primary transmission lead and the secondary transmission lead. A method of converting a standard flat-pack by providing a composite piece having a dielectric insulator, a secondary transmission lead for connection to the transmission lead of the flat-pack, and a connecting member for connecting the insulator and secondary transmission lead to the base of the flat-pack is also described.
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