Cutting composite formed of cemented carbide substrate and diamond layer
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United States of America Patent
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Jun 9, 1992
Grant Date -
N/A
app pub date -
Mar 5, 1991
filing date -
Mar 5, 1991
priority date (Note) -
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Abstract
A composite for cutting in subterranean formations comprises a cemented carbide substrate and a diamond layer adhered to a surface of the substrate. That surface includes a plurality of spaced apart ridges forming grooves therebetween. The diamond layer has a thickness greater than a depth of the grooves and occupies the grooves to interlock with the substrate. The diamond is comprised of a substantially uniform distribution of diamond particles having a grain size in a range of about 25-75 microns. The ridges are spaced radially inwardly from an outer periphery of the substrate, whereby the diamond layer includes an annular ring portion completely surrounding the plurality of ridges to provide radial reinforcement against the formation and propagation of cracks tending to occur in the vicinity of the ridges.
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