Circuit board fabrication
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United States of America Patent
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-
May 26, 1992
Issued Date -
N/A
app pub date -
Sep 28, 1990
filing date -
Mar 28, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A high density multi-level printed wiring board having inter-level electrical connections made by via interconnect holes which are drilled or punched through only those layers of the wiring board that separate the two layers containing the conductors which are to be connected and said holes being filled with a low-resistance silver-filled conductive epoxy.
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