Heat-conductive metal ceramic composite material panel system for improved heat dissipation
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United States of America Patent
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May 12, 1992
Grant Date -
N/A
app pub date -
Aug 7, 1990
filing date -
Aug 7, 1990
priority date (Note) -
Expired
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Abstract
For use as a substrate for a heat generating microelectronic integrated circuit, a ceramic panel is provided having small thickness in comparison to its length and breadth, having on at least the surface opposite the one bearing the microelectronic integrated circuit, a layer of heat conductive metal and having a plurality of closely spaced, small cross section extensions of the heat conductive metal layer extending into the ceramic material to a depth of at least about one fifth of its thickness. The substrate is particularly useful for the mounting of hybrid microelectronic circuits to improve the heat dissipation capability of the ceramic substrate.
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