Roughened polysilicon surface capacitor electrode plate for high denity dram

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United States of America Patent

PATENT NO 5110752
SERIAL NO

07727873

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Abstract

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A method of fabricating a microminaturized capacitor having an electrode that is roughened to increase the effective area per unit area and resulting structure, particularly adapted for use in high density dynamic random access memory devices. The method involves depositing a conductive polycrystalline silicon layer. The depositing a metal such as a refractory metal over the polysilicon layer. The composite layer is heated to form a metal silicide and roughened polycrystalline silicon surface while the grains also grow large. The metal silicide is removed, leaving a roughened surface. The capacitor dielectric layer is deposited upon the roughened surface. The second conductive polycrystalline silicon layer is now formed upon said dielectric layer to complete the capacitor.

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Patent OwnerAddress
INDUSTRIAL TECHNOLOGYY195 SEC 4 CHUNG HSING RD CHUTUNG HSINCHU 31015 R O C

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lu, Chih-Yuan Taipei, TW 60 2459

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