Method and apparatus for solder leveling of printed circuit boards
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United States of America Patent
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-
May 5, 1992
Grant Date -
N/A
app pub date -
Dec 17, 1990
filing date -
Dec 17, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Disclosed is a method and apparatus for fabricating workpieces such as printed circuit boards which include blowing excess solder off the board by a hot air solder leveling technique. A converging/diverging airknife design creates a shock wave, causing a high pressure, low velocity flow pattern which removes solder from the through-holes in the board while leaving sufficient solder on the surface mount features. Additionally, a Mach number of the fluid of less than 0.8 is created.
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