Tray for integrated circuit
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United States of America Patent
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Apr 14, 1992
Grant Date -
N/A
app pub date -
Oct 2, 1989
filing date -
Dec 15, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A tray for an integrated circuit comprising a thermosetting resin compound comprising 20 to 180 parts by weight of a filler with a water absorption of 0.45% or less and 15 to 45 parts by weight of electroconductive carbon black added to 100 parts by weight of a thermosetting resin with a water adsorption of 0.45% or less, desirably with 5 to 15 parts by weight of an acrylonitrile-butadiene type rubber, said tray having a surface resistance of 10.sup.2 to 10.sup.6 .OMEGA., a water absorption of 0.45% or less than a glass transition temperature of 150.degree. C. or higher.
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