Method for manufacturing a semiconductor card with electrical contacts on both faces
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United States of America Patent
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Apr 7, 1992
Issued Date -
N/A
app pub date -
Apr 20, 1989
filing date -
Mar 9, 1983
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Two superimposed series of electric contacts in the shape of metal-sheet strips, electrically connected to a metallic place which supports a semiconductor chip, are electrically separated but mechanically connected by an interposed layer of adhesive material at high insulation. The whole is completely inserted in a covering of insulating material, which forms a flat support, from which, at opposite faces, only limited adjacent contact portions of said electric contacts emerge. The place and at least one of the two series of contacts make part of a single starting metallic frame, on which the other series of contacts is superimposed. This latter in its turn can make part of the same metallic frame and to be superimposed by refolding or can be prepared separately and then applied on the first series.
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