Localized soldering station using state changing medium
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United States of America Patent
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-
Apr 7, 1992
Issued Date -
N/A
app pub date -
Jul 1, 1991
filing date -
Apr 2, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A localized soldering station is described that uses the vapor phase reflow principle. A container has of a medium selected because of the temperature at which it changes to a vapor. A heated conduit maintains the vapor state while conveying the vapor to a work location where a module with a part to be removed or attached by solder connections is supported. A transparent, quartz nozzle confines the vapor to the part and its solder connections and is positioned accurately by a unit that includes a guide light. Vapor will lose its latent heat of vaporization upon contact with the part and its solder connections, causing the solder to reflow and change back to a liquid, which is collected for reuse. When in a standby or ready condition, vapor is conveyed up through a shutoff valve through cooling fins where it changes back to a liquid and returns to the container, avoiding loss.
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