Thermoplastic film, reinforced hollow glass microsphere reinforced laminates for thin low dielectric constant substrates
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United States of America Patent
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Mar 24, 1992
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N/A
app pub date -
Dec 28, 1990
filing date -
Dec 28, 1990
priority date (Note) -
Expired
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Abstract
The present invention is directed to a metal-clad electrical laminate which comprises a core of one or more of a polyetherimide thermoplastic, polyphenylene oxide thermoplastic, or a resinous-filled reinforced substrate. A pair of intermediate layers of hollow glass microsphere-filled polyphenylene oxide/epoxy is bound to either side of the core. Finally, a pair of metal foil layers are bound to the filled intermediate layers to produce the laminate of the present invention. The laminate desirably has a thickness of less than about 0.010 in., a dielectric constant of about 3 or less, and a HGM content in excess of about 10 wt-%. Additionally, the laminate has a softening point sufficiently high to avoid substantial distortion at processing temperatures of around 200.degree.-235.degree. C.
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