Thin film supplying mechanism
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United States of America Patent
Stats
-
Mar 17, 1992
Grant Date -
N/A
app pub date -
Nov 30, 1990
filing date -
Nov 30, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A thin film supplier for supplying ink, paste etc., used in relief-plate printing devices, die bonders etc., including an original printing plate placed on a table. The printing plate is provided with a through hole, and a bridge piece is placed in this hole. A recess is formed in the through hole by the bridge piece which has a thickness less than that of the printing plate, and ink, paste, etc. is poured into the recess so that a relief printing plate attached to a plate holder is immersed in such ink, paste, etc.
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