Arrangement for mounting and cooling high density tab IC chips
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United States of America Patent
Stats
-
Mar 10, 1992
Grant Date -
N/A
app pub date -
Feb 26, 1990
filing date -
Feb 26, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed circuit board assembly includes a printed circuit board having a top side, a bottom side and a hole. A heat spreader which comprises a plate made of a material having high thermal conductivity is mounted on the bottom side of the printed circuit board. The plate includes a pedestal which extends up into the hole. A high density TAB IC chip is mounted on top of the pedestal and is electrically connected to pads on the top side of the printed circuit board. A heat pipe is mounted underneath the plate of the heat spreader through a mounting pad which is fixed to the heat pipe and which is made of a material having good thermal conductivity. In operation, heat generated by the chip during use is spread out by the heat spreader and then removed by the heat pipe.
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