Method for manufacture of an integrated MOS semiconductor array
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Mar 10, 1992
Grant Date -
N/A
app pub date -
Oct 9, 1990
filing date -
Oct 11, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of manufacture of an integrated MOS semiconductor array for the low-frequency range having MOS components and circuit paths arranged on a semiconductor substrate. Exposed surfaces between the circuit paths are made hydrophobic by germinating with hexamethyl disilazane ((CH.sub.3).sub.3 SiNHSi(CH.sub.3).sub.3), so that the occurrence of leakage currents is avoided. In addition, in an integrated MOS semiconductor array in which the MOS components and the circuit path are covered with a protective layer, the surface of this protective layer is made hydrophobic. As a result, both leakage currents and parasitic capacitances are prevented.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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TELEFUNKEN ELECTRONIC GMBH | THERESIENSTR 2 D-7100 HEILBRONN |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Furthaler, Josef | Heilbronn, DE | 1 | 6 |
# of filed Patents : 1 Total Citations : 6 | |||
Gschwend, Friedemann | Heilbronn, DE | 1 | 6 |
# of filed Patents : 1 Total Citations : 6 | |||
Ohagen, Manfred | Untergruppenbach, DE | 2 | 9 |
# of filed Patents : 2 Total Citations : 9 | |||
Tomaszewski, Peter | Heilbronn, DE | 4 | 61 |
# of filed Patents : 4 Total Citations : 61 |
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Patent Citation Ranking
- 6 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 33 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

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Dec 29, 2023 | AS | ASSIGNMENT | free format text: SECURITY INTEREST;ASSIGNOR:VANTAGE MOBILITY, LLC;REEL/FRAME:066432/0573 Owner name: WINGSPIRE CAPITAL LLC, AS ADMINISTRATIVE AGENT, GEORGIA Effective Date: Dec 29, 2023 free format text: SECURITY INTEREST;ASSIGNOR:VANTAGE MOBILITY, LLC;REEL/FRAME:066432/0910 Owner name: WINGSPIRE CAPITAL LLC, AS ADMINISTRATIVE AGENT, GEORGIA Effective Date: Dec 29, 2023 |
Dec 29, 2023 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:VANTAGE MOBILITY INTERNATIONAL, LLC;REEL/FRAME:066213/0065 Owner name: VANTAGE MOBILITY, LLC, ARIZONA Effective Date: Dec 29, 2023 |
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Sep 29, 2015 | I | Issuance | |
Sep 09, 2015 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
May 21, 2015 | F | Filing | |
Dec 10, 2013 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SCHMIDT, MICHAEL J.;GERLINGS, PHIL;NULPH, DAVID;REEL/FRAME:035714/0653 Owner name: VANTAGE MOBILITY INTERNATIONAL, LLC, ARIZONA Effective Date: Dec 10, 2013 |
Jul 12, 2011 | PD | Priority Date |

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