Method for manufacture of an integrated MOS semiconductor array

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United States of America Patent

PATENT NO 5094983
SERIAL NO

07594736

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Abstract

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A method of manufacture of an integrated MOS semiconductor array for the low-frequency range having MOS components and circuit paths arranged on a semiconductor substrate. Exposed surfaces between the circuit paths are made hydrophobic by germinating with hexamethyl disilazane ((CH.sub.3).sub.3 SiNHSi(CH.sub.3).sub.3), so that the occurrence of leakage currents is avoided. In addition, in an integrated MOS semiconductor array in which the MOS components and the circuit path are covered with a protective layer, the surface of this protective layer is made hydrophobic. As a result, both leakage currents and parasitic capacitances are prevented.

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Patent Owner(s)

Patent OwnerAddress
TELEFUNKEN ELECTRONIC GMBHTHERESIENSTR 2 D-7100 HEILBRONN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Furthaler, Josef Heilbronn, DE 1 6
Gschwend, Friedemann Heilbronn, DE 1 6
Ohagen, Manfred Untergruppenbach, DE 2 9
Tomaszewski, Peter Heilbronn, DE 4 61

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