Method of gluing substrates using a composition comprising an arylaliphatic copolyimide with ether chain formations and an epoxy resin

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United States of America Patent

PATENT NO 5093202
SERIAL NO

07561999

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Abstract

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Adhesive compositions are described comprising at least an arylaliphatic olyimide with ether chain formations, obtained by the polycondensation reaction of a tetracarboxylic aromatic acid or of one of its derivatives with at least two primary diamines, one of these diamines consisting of a polyether chain ending with the two amine functional groups and at least an epoxy resin possessing more than one epoxy group per molecular. These adhesive compositions can be used particularly for the gluing of films of polymers to thin metal sheets.

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Patent Owner(s)

Patent OwnerAddress
INSTITUT FRANCAIS DU PETROLE4 AVENUE DE BOIS PREAU 92502 RUEIL MALMAISON

International Classification(s)

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  • 1990 Application Filing Year
  • C09J Class
  • 80 Applications Filed
  • 7 Patents Issued To-Date
  • 8.75 % Issued To-Date

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gonzalez, Serge Cite Berlier, FR 20 67
Mariaggi, Paul Seyssuel, FR 9 46
Rabilloud, Guy Grenoble, FR 12 73
Sillion, Bernard Lyons, FR 33 311

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  • 4 Citation Count
  • C09J Class
  • 0 % this patent is cited more than
  • 33 Age
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