Wallboard bundling tape and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 11, 1992
Grant Date -
N/A
app pub date -
Jan 3, 1990
filing date -
Jan 3, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A bundling tape has two rows of perforations extending from one end of the tape to the other; the perforations are arranged inward of and substantially parallel to the edges. A first band is formed between one edge and a first row of perforations, and a second band is formed between the other edge and the second row or perforations; between the two rows of perforations is a center band tear strip. The bands have co-planar upper and lower surfaces. Adhesive is applied only to the bottom surfaces of the first and second band; there is no adhesive on the center band. Bundles of material, such as wallboard, are fastened together by adhering the bottom surface of the first band to the uppermost sheet of material, and by adhering the bottom portion of the second band to the lowermost sheet.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully