Electroplated gold-copper-zinc alloys
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United States of America Patent
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Feb 4, 1992
Grant Date -
N/A
app pub date -
Nov 6, 1990
filing date -
Nov 6, 1990
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Expired
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Abstract
A solution for electroplating gold-copper-zinc alloys. A solution containing excess cyanide and hydroxide ions, gold and copper each in the form of a cyanide complex, and zinc at least partially in the form of a zincate complex. Additives such as conductivity salts, chelating agents, surfactants or wetting agents, brightening agents, and reducing agents may also be present to impart a particular feature or characteristic to the solution. Also, a process for electroplating up to about 20 microns of a gold-copper-zinc alloy upon a substrate using these novel solutions. The alloy is deposited upon a substrate which is immersed in the solution by electroplating at a current density of between about 1 and 15 ASF (0.1 to 1.5 ASDM) at a temperature of about 60.degree. and 120.degree. F. for a sufficient time to obtain the desired thickness. Generally, thicknesses of 5 to 10 microns or more can be obtained without microcracking. Finally, method for increasing the ductility and corrosion resistance of the deposit by simply heating the deposit to about 50.degree. to 200.degree. C. in air for a time of about 2 to 24 hours.
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