Multilayer transducer with bonded contacts and method for implementation of bonding
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United States of America Patent
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Jan 21, 1992
Grant Date -
N/A
app pub date -
Jul 18, 1990
filing date -
Aug 17, 1989
priority date (Note) -
Expired
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Abstract
In a novel multilayer transducer (1') with bonded contacts and a method for fabricating the bonded contact areas (5') of the transducer, the contact areas (5') are formed on the side surface (7) of the transducer by metal deposition using laser-based deposition, sputter deposition or another suitable metallization method. By virtue of the fabrication method of the contact areas, the size of the transducer (1')can be reduced and the transducer (1') can be bonded to a circuit board using surface-mount technology.
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