Process for producing electrical connections on a universal substrate
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United States of America Patent
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Dec 24, 1991
Grant Date -
N/A
app pub date -
Feb 12, 1990
filing date -
Dec 1, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The process for wiring substrates with a universal pattern of conductors and a large number of predetermined bonding/cutting localities is characterized in that from the quantity of all the possibilities for bonding and cutting is removed the quantity necessary for the realization of a given application, after realization of one given circuit this quantity is tested for further possibilities for realizing the circuit, and the found quantity of possibilities is made available as a correction quantity. The advantage of such a correction potential is that layout or contacting errors can be corrected in a second passage, so that wastage is reduced.
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