Method of making thin film laminate printed circuit
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United States of America Patent
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Dec 24, 1991
Grant Date -
N/A
app pub date -
Jul 19, 1989
filing date -
Jul 19, 1989
priority date (Note) -
Expired
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Abstract
Method of making a multilayer printed circuit including one or more thin film laminates having a circuit etched thereon without tearing, bending, or wrinkling the laminate during fabrication and which allows the use of standard multilayer etching and registration processes. The method involves the application of a low melting point plastic adhesive to a temporary backing for adhering a thin film laminate to the backing for etching and registration. A high melting point adhesive is then used to laminate an inner layer assembly to the thin film laminate/temporary backing assembly and the temporary backing removed by heating to the melting point of the plastic adhesive. The method can be used to make multilayer printed circuits or a circuit for a blasting cap for initiating the explosion of a secondary explosive.
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