Method for photoresist stripping using reverse flow

United States of America Patent

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Dec 10, 1991
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N/A
app pub date
Sep 11, 1990
filing date
Sep 11, 1990

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Expired

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Abstract

A method and apparatus for stripping a photoresist layer from a semiconductor wafer, wherein oxidizing gas is fed from the edge of the wafer to the center. The oxidizing gas may be directed so that it is incident on the heated wafer support platform before it is incident on the wafer.

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Patent Owner(s)

Patent Owner	Address
LG ELECTRONICS INC	128 YEOUI-DAERO YEONGDEUNGPO-GU SEOUL 07336

International Classification(s)

B08B:CLEANING IN GENERAL; PREVENTION OF FOULING IN GENE....

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[Patents Count]

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Inventor Name	Address	# of filed Patents	Total Citations
Ferris, David S	Washington, DC	4	120
Matthews, John C	Gaithersburg, MD	10	721
Rounds, Stuart N	Germantown, MD	2	124
Wooten, Robert D	Rockville, MD	6	129

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Method for photoresist stripping using reverse flow

Number of patents in Portfolio can not be more than 2000

United States of America Patent

07580928

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PATENT NO	5071485
SERIAL NO	07580928
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07580928

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