Photoimageable permanent resist
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United States of America Patent
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-
Dec 3, 1991
Issued Date -
N/A
app pub date -
Aug 11, 1989
filing date -
Sep 13, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Compositions which include an acidified epoxy oligomer, a free radical photoinitiator and a monomer capable of being polymerized by the photoinitiator are used to form aqueous developable, photodefined coatings useful as permanent solder marks for printed circuits and permanent plating resists for additive printed wiring boards. The process for using the compositions include application as a fluid in solvents; drying; exposing to ultraviolet light; developing in an aqueous alkaline solution; and crosslinking the acidified, epoxy oligomers. The articles produced include printed wiring boards with the permanent, photoimaged resist composition thereon.
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