Method and apparatus for notching a lead wire attached to an IC chip to facilitate severing the wire
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United States of America Patent
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Nov 26, 1991
Grant Date -
N/A
app pub date -
Nov 2, 1990
filing date -
Nov 2, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and apparatus for notching a wire so that it can be severed at the notched location by applying an axial force thereto. The apparatus includes a linearly reciprocal mechanism adapted to move forwardly, placing a pair of cutting blades in straddling relationship with the wire and includes an actuating mechanism for laterally reciprocating the cutting blades to form notches in opposite sides of the wire before retracting the cutting blades from the straddling relationship with the wire. The method of the invention includes the steps of moving a pair of cutting blades into straddling relationship with a wire, reciprocally moving the cutting blades into and out of cutting engagement with the wire and subsequently retracting the cutting blades from the straddling relationship with the wire.
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