Resistor under wirebond pad
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United States of America Patent
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-
Nov 19, 1991
Grant Date -
N/A
app pub date -
Oct 23, 1989
filing date -
Oct 23, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A preferred embodiment of the invention is a poly input resistor located underneath, rather than alongside, an IC wirebond pad. This offers the advantages of a more efficient layout, more contacts connecting the pad to the resistor, a better contact configuration, and a larger, higher current resistor.
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