Soldering apparatus of a reflow type
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United States of America Patent
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Nov 19, 1991
Grant Date -
N/A
app pub date -
Oct 3, 1989
filing date -
Oct 4, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A soldering apparatus of a reflow type contains a preheating chamber and a reflow chamber which are provided with a plurality of heaters for heating printed circuit boards with chips temporarily mounted thereon with solder pastes during conveyance by a conveyor. The heaters are mounted on the side walls of the chamber, extending along a direction of conveyance of the printed circuit boards. The chambers are also provided with a screening member respectively so as to prevent direct radiation of radiant heat from the heaters into the chambers and onto the printed circuit boards and to provide a uniform air flow so as to be blown uniformly onto the printed circuit boards.
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