Sealing glass composition and electrically conductive formulation containing same
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United States of America Patent
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Nov 19, 1991
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N/A
app pub date -
Jun 21, 1990
filing date -
Jun 21, 1990
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Expired
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Abstract
Described is a sealing glass composition comprising, in wt. %, 13-50% lead oxide, 20-50% vanadium oxide, 2-40% tellurium oxide, up to 40% selenium oxide, up to 10% phosphorous oxide, up to 5% niobium oxide, up to 20% bismuth oxide, up to 5% copper oxide and up to 10% boron oxide and an electrically conductive formulation comprising, in wt. %, 50-77% silver, 8-34% of a sealing glass composition as described previously, 0.2-1.5% resin and thixotrope and 10-20% organic solvent.
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