Process of producing monolithically integrated multifunction circuit arrangements
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United States of America Patent
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Nov 19, 1991
Grant Date -
N/A
app pub date -
Apr 21, 1989
filing date -
Apr 23, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process for producing monolithically integrated multifunction circuit arrangements. A substrate having an integrated circuit formed therein is provided, and further multilayer semiconductor components and the corresponding electrical leads are arranged on top of one another on the substrate surface. The multilayer semiconductor components and the electrical leads are produced from an epitaxially grown semiconductor layer sequence.
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