Thermosetting polyimide schiff base resins, their preparation and their applications
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United States of America Patent
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Nov 12, 1991
Grant Date -
N/A
app pub date -
Apr 2, 1990
filing date -
Mar 31, 1989
priority date (Note) -
Expired
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Abstract
Thermosetting Schiff base resins, their preparation and their applicationsre described. These thermosetting Schiff base resins can be defined as responding to the general formula: ##STR1## Radicals Ar.sub.1, Ar.sub.2 and Ar.sub.3 are chosen so that the softening temperature of the resins is less than about 150.degree. C. The resins can be prepared by direct condensation of an ethynyl benzaldehyde or acetophenone on a telechelic diamine oligomer obtained by reaction of a diamine containing flexibilizing groups on a derivative of benzhydrol tetracarboxylic acid. These Schiff base resins can be used by bulk thermal polymerization particularly to prepare adhesives or composite matrices.
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