No-clean solder paste vehicle
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United States of America Patent
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Nov 12, 1991
Grant Date -
N/A
app pub date -
Nov 8, 1990
filing date -
Nov 8, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A paste vehicle for use in a metal bearing solder paste composition having a heat-polymerizable binder is provided. This vehicle can be non-aqueous, inorganic salt-free and dispersed in a non-aqueous, organic liquid, and may be incorporated with a flux into a solder paste composition capable of utilizing an average particle size finer than 100 mesh. This paste has excellent anti-slump properties, requires no cleanup to remove residual solder reflow, and permits smaller more controlled joints to be formed.
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