wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus
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United States of America Patent
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Oct 29, 1991
Issued Date -
N/A
app pub date -
Oct 2, 1990
filing date -
Dec 25, 1985
priority date (Note) -
Expired
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Abstract
A wire bonding method and apparatus comprising a comparator wherein a difference between a position command signal for displacing a moving member such as, for example, a wire bonding tool, and a position signal obtained from a sensor for detecting the position of the moving member is compared with a predetermined threshold or reference value so that a stopping of the moving member, caused by an external force such as a contact therewith with another member can be rapidly and accurately electrically detected. A wire bonding method and apparatus is useable for producing a semiconductor device.
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